As electronic devices become more powerful and compact, efficient heat dissipation is essential for performance, safety, and longevity. Among the latest innovations in thermal interface materials (TIMs), High viscosity thermal gel have gained attention for his or her ability to deliver consistent thermal conductivity while adapting to demanding applications. https://trevorjkih83950.livebloggs.com/44077903/high-viscosity-thermal-gel-advanced-heat-management-for-electronics